Electronic component and method of producing the same

Details Electronic component and method of producing the same Electronic component and method of producing the same

2005-01-04

2005-01-04

Cuneo, Kamand (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S192000, C361S311000, C361S306100, C361S306300, C310S344000, C340S320000

Reexamination Certificate

active

06839243

ABSTRACT:
An electronic component includes a laminate having a structure in which an element substrate and a sealing substrate are bonded to each other through an adhesive layer, a terminal electrode is arranged on the element substrate so as to be exposed at an end surface of the laminate, an outside electrode is disposed on the outer surface of the sealing substrate, the terminal electrode and the outside electrode are electrically connected to each other through an end surface electrode disposed on the end surface of the laminate, and the thickness of the end surface electrode is between about one half of the thickness of the adhesive layer and about five times of the thickness thereof.

REFERENCES:
patent: 6064282 (2000-05-01), Futakuchi et al.
patent: 6531806 (2003-03-01), Daidai
patent: 20020048126 (2002-04-01), Shimazawa

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