Electronic component and method of manufacturing the same

Details Electronic component and method of manufacturing the same Electronic component and method of manufacturing the same

2006-08-07

2011-11-01

Chen, Xiaoliang (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S306300, C361S321200, C361S330000, C361S704000, C336S192000, C336S200000, C427S333000, C029S830000, C333S131000, C333S181000, C333S185000, C428S138000

Reexamination Certificate

active

08050045

ABSTRACT:
The invention relates to a surface mount type electronic component mounted on a printed circuit board or hybrid IC (HIC) and a method of manufacturing the same and provides an electronic component which can be formed with a small size and a low height at a low cost and a method of manufacturing the same. A common mode choke coil as the electronic component has an overall shape in the form of rectangular parallelepiped that is provided by forming an insulation layer, a coil layer (not shown) formed with a coil conductor, and external electrodes electrically connected to the coil conductor in the order listed on a silicon substrate using thin film forming techniques. The external electrodes are formed to spread on a top surface (mounting surface) of the insulation layer.

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Jul. 13, 2010 Office Action issued in Japanese patent application No. 2005-237664 (with translation).

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