Electronic component and method of manufacturing the same

Details Electronic component and method of manufacturing the same Electronic component and method of manufacturing the same

2005-04-26

2005-04-26

Koehler, Robert R. (Department: 1775)

Stock material or miscellaneous articles

All metal or with adjacent metals

Composite; i.e., plural, adjacent, spatially distinct metal...

C428S647000, C428S648000, C428S935000, C205S122000, C205S149000, C205S154000, C205S225000, C205S226000, C205S252000, C205S300000

Reexamination Certificate

active

06884523

ABSTRACT:
An external terminal of an electronic component is provided with a lead base material and a metal thin film coating a surface of the lead base material, and an average value of a crystal size index is not less than 7, which is defined based on dimensions of a crystal particle in a direction perpendicular to the lead base material surface and in a direction parallel thereto, taken on a cut surface of the metal thin film defined by a given plane cutting the metal thin film in a direction perpendicular to the lead base material surface. Such constitution provides an electronic component having an external terminal coated with a metal thin film of a simple structure constituted of Sn or a Sn-based and substantially Pb-free alloy, formed by plating on a surface of a lead base material.

REFERENCES:
patent: 2-170996 (1990-07-01), None
patent: 2001-110666 (2001-04-01), None
patent: 2002-246208 (2002-08-01), None
R. Kawanaka et al.: “Role of Lead in Growth Suppression and Growth Mechanism of Tin Proper Whisker”, pp 148-156; vol. 10, No. 2; 1983, no month given.

Affiliated with

Also associated with

Rating

Electronic component and method of manufacturing the same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electronic component and method of manufacturing the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electronic component and method of manufacturing the same will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3427137