Stock material or miscellaneous articles – Composite – Of quartz or glass
Reexamination Certificate
2001-08-30
2004-11-09
Stein, Stephen (Department: 1775)
Stock material or miscellaneous articles
Composite
Of quartz or glass
C428S432000, C428S433000, C428S697000, C075S245000, C075S255000, C420S505000, C427S372200, C427S375000, C427S376300, C427S376400
Reexamination Certificate
active
06815073
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a technique for forming a silver-based conductor film on a surface of an electronic component board including glass.
2. Description of the Related Art
A low temperature co-fired ceramic (LTCC) multilayer printed circuit board is formed by laminating and firing a green sheet of glass ceramic having a sintering temperature of 1000° C. or less after conductor paste printing. A bonding pad provided on the surface of the low temperature sintered ceramic multilayer printed circuit board is formed by a thick film processing, for example. More specifically, a thick film conductor paste is printed on the surface of the LTCC multilayer printed circuit board and is then fired. For the thick film conductor paste thus used, Japanese Laid-Open Patent Publication No. 1-298090 has described a conductor composition obtained by kneading silver-based metal powder which can be fired in the air and inorganic additives (such as glass frit, a bismuth compound, zinc and/or a zinc compound, nickel and/or a nickel compound).
For a conductor pattern on the board surface, it is generally required that (1) a solder wettability is good, (2) a bonding strength to the board is great and (3) a bond with a gold wire is reliable.
However, in the case where the conductor pattern on the surface of the LTCC multilayer printed circuit board is formed of a silver-based conductor, it is hard to satisfy all the three requirements (1), (2) and (3) for the conductor pattern. For example, the bonding pad formed of the silver-based conductor is not suitable for the wire bonding of the gold wire.
SUMMARY OF THE INVENTION
The present invention has an object to more enhance the reliability of the electrical connection of a silver-based conductor pattern on the surface of a glass ceramic board. In order to achieve the above-mentioned object, according to the present invention, a conductor paste containing silver particles having a specific surface area of 0.3 m
2
/g to 3.0 m
2
/g is fired at a temperature having a difference of ±50° C. from the softening temperature of glass, thereby forming a conductor film on the glass ceramic board.
REFERENCES:
patent: 3872360 (1975-03-01), Sheard
patent: 4336551 (1982-06-01), Fujita et al.
patent: 5292359 (1994-03-01), Jeng-Shyong et al.
patent: 5527627 (1996-06-01), Lautzenhiser et al.
patent: 5652042 (1997-07-01), Kawakita et al.
patent: 6338893 (2002-01-01), Kodera et al.
patent: 6404318 (2002-06-01), Uchikoba et al.
patent: 1-298090 (1989-01-01), None
Akutsu Yasuo
Fujita Tsuyoshi
Kirigaya Masato
Soma Hiroshi
Tanei Hirayoshi
Blackwell-Rudasill G.
Hitachi , Ltd.
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