Electronic component and method of manufacturing same

Details Electronic component and method of manufacturing same Electronic component and method of manufacturing same

2005-11-22

2005-11-22

Thai, Luan (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

With shielding

C257S660000, C257S699000, C257S676000

Reexamination Certificate

active

06967390

ABSTRACT:
An electronic component includes an electronic chip (110) and a chip carrier portion (120) having sidewalls (121) and a bottom portion (122). The electronic chip is mounted over the bottom portion of the chip carrier portion, and the chip carrier portion shields the electronic chip from radiation outside of the electronic component.

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patent: 6777819 (2004-08-01), Huang
patent: 2001/0019780 (2001-09-01), Obata et al.

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