Electronic component and method of manufacture

Details Electronic component and method of manufacture Electronic component and method of manufacture

1999-04-19

2000-05-02

Gulakowski, Randy

Etching a substrate: processes

Forming or treating electrical conductor article

Forming or treating resistive material

338 42, H01B 1300

Patent

active

060568887

ABSTRACT:
An electronic component includes a substrate (201) with a surface (202), a resistor structure (210) supported by the substrate, and a passivation layer (300, 805) over the resistor and the surface of the substrate where the passivation layer has a hole (311, 312, 611, 612, 613, 614, 711, 811), where the surface of the substrate has a compressive portion and a tensile portion, and where the resistor is located between the compressive and tensile portions of the surface.

REFERENCES:
patent: 4125820 (1978-11-01), Marshall
patent: 4838088 (1989-06-01), Murakami
patent: 4996082 (1991-02-01), Guckel et al.
patent: 5178016 (1993-01-01), Dauenhauer et al.
patent: 5493470 (1996-02-01), Zavracky et al.
patent: 5702619 (1997-12-01), Kurtz et al.
patent: 5747705 (1998-05-01), Herb et al.
patent: 6006607 (1999-12-01), Bryzek et al.

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