Electronic component and method of fabricating same

Details Electronic component and method of fabricating same Electronic component and method of fabricating same

1994-09-12

1999-02-16

Kincaid, Kristine L.

Electricity: conductors and insulators

Anti-inductive structures

Conductor transposition

174 524, 174 523, 257659, 257680, H05K 900

Patent

active

058723315

ABSTRACT:
An improved hermetically sealed case for enclosing an electronic element, wherein the case has an upper portion and a lower portion connected together by atomic bonding. The upper portion includes through holes. Each hole forms a lead to provide a connection from the outside of the case to the element within the case. Each lead is arranged in the through hole to seal the hole hermetically and yet provide an electrical contact for the element. The sealed case prevents the electronic element from being deteriorated by hazardous gas generated by the conventional welding process used to seal such cases.

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