Electronic component and method for manufacturing the same

Details Electronic component and method for manufacturing the same Electronic component and method for manufacturing the same

2007-11-29

2010-06-22

Nguyen, Chau N (Department: 2831)

Electricity: conductors and insulators

Conduits, cables or conductors

Conductor structure

C174S1170FF

Reexamination Certificate

active

07741565

ABSTRACT:
In conventional electronic components, having a substrate as a component of the structure has been an obstacle to an ultra-low profile design. To address the problem, the present invention provides an improved structure without a substrate. Internal electrode15is formed into a predetermined coil pattern. Bumps16and irregularities17are formed on confronting surfaces of the component, by which each component is hard-to-cling with one another. On the other hand, the confronting side-surfaces with no bumps16or irregularities17allow a mounting device to have an improved vacuum suction force. Such structured electronic component maintains easy handling even when it is extremely downsized.

REFERENCES:
patent: 09-270355 (1997-10-01), None
patent: 2001-358020 (2001-12-01), None

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