Electricity: electrical systems and devices – Safety and protection of systems and devices – With specific circuit breaker or control structure
Reexamination Certificate
2001-08-27
2004-10-12
Jackson, Stephen W. (Department: 2836)
Electricity: electrical systems and devices
Safety and protection of systems and devices
With specific circuit breaker or control structure
C361S714000, C361S748000
Reexamination Certificate
active
06804103
ABSTRACT:
TECHNICAL FIELD
The present invention relates to a SAW (Surface Acoustic Wave) device or the like electronic component that houses electronic device chip in the package. The present invention relates also to a method for manufacturing the electronic components.
BACKGROUND ART
FIG. 5
shows a plan view of a conventional SAW device, while
FIG. 6
shows the cross sectional view. As shown in these drawings, a conventional SAW device is manufactured by first stacking a first ceramic frame body
101
on one of the surfaces of a ceramic substrate
100
, and a second ceramic frame body
102
on the first ceramic frame body
101
, and these frame bodies together with the substrate are fired to form an integrated package
103
. An internal contact electrode
104
and a shield electrode
105
are formed on certain predetermined areas of the package
103
, and a seam ring
110
is provided on the upper-end surface of the package by means of silver brazing. And then, the internal contact electrode
104
, the shield electrode
105
and the seam ring
110
are gold plated on the surface.
A SAW chip
107
is comprised of comb-formed electrodes for input/output formed on a piezoelectric substrate (not shown), and reflector electrodes and contact electrodes coupled with the comb-formed electrodes provided at both sides of the comb-formed electrode. The SAW chip
107
is mounted on the bottom surface of a cavity of the package
103
; namely, it is mounted on the shield electrode
105
provided on the surface of ceramic substrate
100
, with an adhesion layer
106
interposed in between. Next, a pattern recognition is conducted from above the package
103
, namely from the seam ring
110
side towards the SAW chip
107
, for detecting boundaries between the second ceramic frame body
102
and the first ceramic frame body
101
, and between the internal contact electrode
104
and a non-internal contact electrode portion
108
a
,
108
b.
A location for bonding a wire
109
on the internal contact electrode
104
is determined based on the two boundaries detected through the above procedure as well as the dimensional particulars of the package
103
.
In accordance with the location determined as above, the SAW chip
107
and the internal contact electrode
104
are interconnected by the wire
109
, and then a lid
111
is welded on the seam ring
110
of package
103
.
In the above-described conventional technology, however, it is extremely difficult to establish the location at a high accuracy level, because of a displacement which occurs when silver-brazing the seam ring
110
.
If a location thus determined is not accurate enough, the wire
109
, for example, could be connected erroneously with the shield electrode
105
, or an defective connection between the wire
109
and the internal contact electrode
104
might arise.
The present invention aims to offer an electronic component, in which an electronic device chip can be aligned to a certain specific location at a high accuracy level and an accurate location is established at a high accuracy level for bonding a wire on the internal contact electrode. A method for manufacturing the electronic components is also offered by the present invention.
DISCLOSURE OF THE INVENTION
The outline structure of an electronic component of the present invention is that it is provided with a pattern suitable for aligning a SAW device chip or the like electronic device chip and an interconnection wire accurately to certain specified places of a package of the electronic component.
The outline of a method for manufacturing the electronic components of the present invention is that the package is provided with a stepped level-difference on the inner wall of cavity, and aligning of at least either said device chip or interconnection wire to a certain specified location is effected after detecting the boundary formed by the stepped level-difference and the inner bottom surface of said package at a high accuracy level.
Practically described, an electronic component of the present invention comprises a package, which having a cavity formed within and the cavity is provided with a stepped level-difference on the inner wall surface; an internal contact electrode provided on the upper end-surface of said stepped level-difference of the inner wall; a shield electrode; provided on the inner bottom surface of said package; a device chip disposed on the shield electrode; and an interconnection wire for connecting the device chip with said internal contact electrode. Said inner bottom surface is provided with a non-electrode portion, which region is used for aligning at least either said device chip or said interconnection wire to a certain specific location. Said non-electrode portion can be used as a recognition pattern for aligning at least either the device chip or the interconnection wire to a certain specific location in the package. Since the non-electrode portion is different in color from the shield electrode formed on the inner bottom surface of the package, a place for mounting the device chip and a spot for bonding the interconnection wire on the internal contact electrode can be determined accurately by making use of the non-electrode portion.
Another electronic component of the present invention comprises a ceramic substrate; a first ceramic frame body formed on one of the surfaces of said ceramic substrate; a second ceramic frame body formed on said first ceramic frame body; stepped level-differences formed between said ceramic substrate and said first ceramic frame body and between said first ceramic frame body and said second ceramic frame body; an internal contact electrode formed on one of the surfaces of said first ceramic frame body, which surface being in the same side as a junction formed between said first ceramic frame body and said second ceramic frame body, which internal contact electrode extending over the side faces of said first ceramic frame body and said ceramic substrate as far as the other surface of said ceramic substrate; a shield electrode formed on the one surface of said ceramic substrate for having said device chip thereon, and said device chip is mounted on said shield electrode; and an interconnection wire for connecting said device chip with said internal contact electrode. The inner bottom surface of said package is provided with a non-electrode portion, which region is used for aligning at least either said device chip or said interconnection wire to a certain specific location. As already described above, the non-electrode portion may be considered as a recognition pattern for aligning at least either the device chip or the interconnection wire to a certain specific location. Thus a place for mounting the device chip and a spot for bonding the interconnection wire on the internal contact electrode can be determined at a high accuracy level.
Other features of the electronic component of the present invention include that it is provided with said non-electrode portion for at least two, said device chip is disposed on said shield electrode at an area that is specified by connecting said two non-electrode portions. When viewed from above the package, one of the sides of said non-electrode portion is coincidental with one of the sides of said internal contact electrode. Furthermore, one of the sides of said internal contact electrode, or the extension, is crossing substantially at a right angle with one of the sides of said non-electrode portion, or the extension. The clearance formed between the opposing inner walls of a package is greater at the lower stepped level-difference than at the upper stepped level-difference. In the electronic component of the present invention, a place for mounting the device chip and a spot for bonding the interconnection wire on the internal contact electrode can be determined at a higher accuracy level by taking advantage of the above-described features. In the electronic component of the present invention, the upper surfaces of the internal contact electrode and the device chip are disposed on subs
Fujii Kunihiro
Matsuo Satoshi
Murakami Kozo
Jackson Stephen W.
Matsushita Electric - Industrial Co., Ltd.
RatnerPrestia
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