Electronic component and method for manufacturing an...

Details Electronic component and method for manufacturing an... Electronic component and method for manufacturing an...

2011-02-01

2011-02-01

Williams, Alexander O (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

C257SE23031, C257SE23019, C257SE23142, C257SE23001, C257SE23034, C257SE23044, C257SE21001, C257S734000, C257S777000, C257S686000, C257S685000, C257S666000, C257S782000, C257S784000, C257S796000, C257S712000, C257S713000, C257S717000, C257S720000

Reexamination Certificate

active

07880280

ABSTRACT:
An electronic component has at least two semiconductor devices, a contact clip and a leadframe with a device carrier portion and a plurality of leads. The contact clip extends between the first side of at least two semiconductor devices and at least one lead of the leadframe to electrically connect a load electrode of the at least two semiconductor devices to at least one lead.

REFERENCES:
patent: 5705848 (1998-01-01), Bayerer
patent: 6624522 (2003-09-01), Standing et al.
patent: 7271470 (2007-09-01), Otremba
patent: 7615854 (2009-11-01), Montgomery
patent: 2006/0087026 (2006-04-01), Cao et al.
patent: 19612514 (1997-05-01), None
patent: 10301091 (2004-07-01), None

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