Electronic component and method for its production

Details Electronic component and method for its production Electronic component and method for its production

2006-02-14

2006-02-14

Parekh, Nitin (Department: 2811)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S124000, C438S126000, C438S127000, C257S666000, C257S787000, C257S723000

Reexamination Certificate

active

06998296

ABSTRACT:
The invention relates to an electronic component and to a method for its production. The electronic component has a semiconductor chip and a wiring board, and a plastic package. The plastic package is divided into two plastic package molding compounds arranged one on top of the other. Of the plastic package molding compounds a first layeroof plastic package molding compound forms a relatively uneven surface, which is smoothed by a second layer of plastic package molding compound so that the electronic component has smooth outer sides of the plastic package.

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