Electronic component and method for its production

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices

Reexamination Certificate

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Details

C438S124000, C438S126000, C438S127000, C257S666000, C257S787000, C257S723000

Reexamination Certificate

active

06998296

ABSTRACT:
The invention relates to an electronic component and to a method for its production. The electronic component has a semiconductor chip and a wiring board, and a plastic package. The plastic package is divided into two plastic package molding compounds arranged one on top of the other. Of the plastic package molding compounds a first layeroof plastic package molding compound forms a relatively uneven surface, which is smoothed by a second layer of plastic package molding compound so that the electronic component has smooth outer sides of the plastic package.

REFERENCES:
patent: 6048755 (2000-04-01), Jiang et al.
patent: 6301511 (2001-10-01), Fujita et al.
patent: 6326240 (2001-12-01), Liaw
patent: 2002/0168798 (2002-11-01), Glenn et al.
patent: 2002/0187591 (2002-12-01), Bai
patent: 2003/0108100 (2003-06-01), Sekiguchi et al.
patent: 0 644 507 (1995-03-01), None
patent: 0 892 427 (1999-01-01), None
patent: 58-182837 (1983-10-01), None
patent: 09064077 (1997-03-01), None
patent: 11040588 (1999-02-01), None
patent: 11040591 (1999-02-01), None
patent: 11067799 (1999-03-01), None
patent: WO 03/054957 (2003-07-01), None

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