Electronic component and manufacturing method thereof

Details Electronic component and manufacturing method thereof Electronic component and manufacturing method thereof

2006-07-10

2009-02-03

Tran, Anh Q (Department: 2819)

Wave transmission lines and networks

Coupling networks

Electromechanical filter

C333S186000, C333S187000

Reexamination Certificate

active

07486160

ABSTRACT:
There is provided an electronic component excellent in moisture resistance capable of ensuring electrical connection between electrodes and hermeticity of a sealed region including a vibrating part and suppressing an increase in size. An electronic component including a piezoelectric element provided with a vibrating part and a first electrode on one face of a piezoelectric substrate and a printed circuit substrate having a second electrode is constituted by including: a bump provided in advance on one of the first electrode and the second electrode and connected to the other of the first electrode and the second electrode; an annular first metal layer surrounding the vibrating part; and a solder material with a solidus temperature lower than the bump, sealing a space between the first metal layer and the printed circuit substrate to make a placement region of the vibrating part a hermetic space, whereby moisture permeation into the hermetic space and the outward spread of the solder material can be suppressed, and a space for the bump to spread by being melted can be omitted. Moreover, the electrical connection between the electrodes and the sealing of the placement region can be performed in separate processes, so that high hermeticity can be obtained.

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