Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – Frame
Patent
1995-01-31
1997-07-01
Phillips, Michael W.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
Frame
361752, 361796, H02B 101
Patent
active
056444788
ABSTRACT:
An electronic element which is free of many of the impurities that tend to adversely affect its operation. The electronic element is hermetically sealed in a space formed by a framework having a first and second plate directly joined to its sides. Directly joining the first and second plates to the framework prevents splashes of adhesive and soldering material from effecting the operation of the electronic element.
REFERENCES:
patent: 4639631 (1987-01-01), Chason et al.
patent: 4908738 (1990-03-01), Kobari et al.
patent: 5285354 (1994-02-01), Ohsawa et al.
Ando Daizo
Nakamura Tadashi
Oishi Kunihiko
Umeda Shinji
Matsushita Electric - Industrial Co., Ltd.
Phillips Michael W.
Whang Y.
LandOfFree
Electronic component and its manufacturing method does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Electronic component and its manufacturing method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electronic component and its manufacturing method will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-602457