Electrical generator or motor structure – Non-dynamoelectric – Piezoelectric elements and devices
Patent
1995-02-01
1995-11-21
Budd, Mark O.
Electrical generator or motor structure
Non-dynamoelectric
Piezoelectric elements and devices
310324, H01L 4108
Patent
active
054690129
DESCRIPTION:
BRIEF SUMMARY
TECHNICAL FIELD
The present invention relates to electronic components such as piezoelectric parts and the like.
BACKGROUND ART
The best known electronic component of this type to date comprises an electronic element, a supporting member, a resin layer and a solder. As shown in FIG. 11, the electronic element B1 has a lead electrode B4 at the edge, and the supporting member B2 is positioned opposite the electronic element B1 across a gap G. The supporting member B2 has an external connecting terminal B5 which extends from the front surface to the bottom surface of the supporting member B2 at a location that faces the lead electrode B4 across the notch. The resin layer B3 is positioned between the electronic element B1 and the supporting member B2 and bonds the electronic element B1 to the supporting member B2. The solder B6 fills the space at the notch and connects the lead electrode B4 with the external connecting terminal B5.
However, as shown in FIG. 12, the electronic component of the prior art has a problem in that when it is mounted on a printed board P, the solder B6 which connects the lead electrode B4, which is formed adjacent to the electronic element B1, with the external connecting terminal B5, which is formed adjacent to the supporting member B2, tends to remelt and become absorbed into the solder S applied to the printed board P, resulting in a defective connection between the lead electrode B4 and the external connecting terminal B5.
DISCLOSURE OF INVENTION
It is an object of the present invention to provide an electronic component of which defective connections including disconnections due to solder bridging are prevented.
Another object of the present invention is to provide an electronic component which can be directly mounted on a circuit board by soldering the external connecting terminal to the conductors formed on the circuit board,
A further object of the present invention is to provide an electronic component of which the filling solder, which connects the lead electrode with the external connecting terminal, does not remelt and thus precludes to become absorbed into the paste solder applied to the circuit board when the electronic component is mounted thereon.
A still further object of the present invention is to provide an electronic component of which the electronic element is not likely to be subject to the effect of soldering heat, and in which it is possible to prevent degradation of the electronic element characteristics, caused by solder adhering to the element.
A still further object of the present invention is to provide an electronic component of which chipping and other damage caused during transportation and while mounting can be prevented, and one of which it is not likely that adhesion loss will occur, even in the case of an external thermal shock or the like.
In order to achieve the above objects, the electronic component of the present invention comprises an electronic element, a supporting member, a resin layer and a solder. The electronic element has a lead electrode at the edge. The supporting member is positioned at a location that faces the electronic element across a gap G. The supporting member has an external connecting terminal at a location that faces the afore-mentioned lead electrode. The resin layer is positioned between the electronic element and the supporting member, indented by a distance d from the edge of the electronic element and bonds the electronic element and the supporting member. The distance d satisfies the following relationship with the gap G; d>G . The solder fills the space formed by the gap G over the distance d and connects the lead electrode and the external connecting terminal.
Due to the afore-mentioned arrangement, i.e., that the supporting member is positioned at a location that faces the electronic element across the gap G; that the resin layer is positioned between the electronic element and the supporting member, indented by the distance d from the edge of the electronic element; that the relationship of the distanc
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Ishihara Susumu
Katoh Ikuo
Sugawara Yuuichi
Suzuki Yoshihisa
Budd Mark O.
TDK Corporation
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