Electronic component

Details Electronic component Electronic component

1986-12-30

1988-06-21

Davie, James W.

357 40, 357 56, 357 65, H01L 2714, H01L 2348

Patent

active

047528168

ABSTRACT:
The electronic component includes a mounting substrate having a surface provided with a plurality of spaced contact pads. A semiconductor chip is mounted on the substrate and includes at least one active element in the form of a photodiode on a substrate of light transmissive material. The active element has a metallized contact region and the semiconductor chip has a plurality of projecting metallized contact regions which are each electrically conductively bonded to a different one of the spaced contact pads of the mounting substrate. The photodiode may be a PIN diode and the semiconductor chips may be an integrated circuit to which the PIN diode is connected thereby providing an optical receiver equivalent to a PIN receiver.

REFERENCES:
patent: 4021838 (1977-05-01), Warwick
patent: 4161740 (1979-07-01), Frey
patent: 4250520 (1981-02-01), Denlinger
Leheny et al., "An Integrated PIN/FET Photoreceiver for Long Wavelengths Optical Systems", 12/7-9/81, Conference: International Electron Devices Meeting, pp. 276-279.
Aoriuchi et al., "A New LED Structure with a Self-Aligned Sphere Lens for Efficient Coupling to Optical Fibers", Jul. 1977, IEEE Transactions on Electron Devices, vol. ED-24, No. 7, pp. 986-990.

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