Electronic component

Details Electronic component Electronic component

2006-10-25

2010-12-21

Smith, Zandra (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

C257S767000, C257S751000, C257S368000, C257SE21017, C257SE21582

Reexamination Certificate

active

07855458

ABSTRACT:
An electronic component includes a substrate, and a capacitor unit on the substrate. The capacitor unit has a laminate structure including a first electrode layer provided on the substrate, a second electrode layer opposed to the first electrode layer, and a dielectric layer disposed between the first and the second electrode layers. The first electrode layer has a multilayer structure including an adhesion metal layer joined to the dielectric layer. The adhesion metal layer is provided with an oxide coating on a side of the dielectric layer.

REFERENCES:
patent: 6023407 (2000-02-01), Farooq et al.
patent: 2003/0211699 (2003-11-01), Lin et al.
patent: 2003/0213615 (2003-11-01), Utsumi et al.
patent: 2005/0037535 (2005-02-01), Ogawa et al.
patent: 2005/0045891 (2005-03-01), Yamazaki et al.
patent: 2005/0104220 (2005-05-01), Tsuchiya et al.
patent: 2005/0175938 (2005-08-01), Casper et al.
patent: 2006/0097344 (2006-05-01), Casper et al.
patent: 2006/0131069 (2006-06-01), Shimizu et al.
patent: 2006/0157766 (2006-07-01), Won et al.
patent: 4-61264 (1992-02-01), None
patent: 9-102590 (1997-04-01), None
patent: 2000-68645 (2000-03-01), None
patent: 2002-33239 (2002-01-01), None
Search Report corresponding to Chinese application No. 200610144641X dated Mar. 20, 2009.

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