Electronic component

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement

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Details

174257, 361784, H05K 100

Patent

active

054019109

ABSTRACT:
A ceramic substrate has a single plating film formed on both wiring electrodes formed on an upper surface of a ceramic body and external electrodes formed on side surfaces and a lower surface of the ceramic body. The plating film on the wiring electrodes and the external electrodes has a first plating layer made of Ni and a second plating layer made of Sn.

REFERENCES:
patent: 5107394 (1992-04-01), Naito et al.
patent: 5227951 (1993-07-01), de Neuf et al.
patent: 5251094 (1993-10-01), Amano et al.

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