Electronic circuits having NiAl and Ni.sub.3 Al substrates

Details Electronic circuits having NiAl and Ni.sub.3 Al substrates Electronic circuits having NiAl and Ni.sub.3 Al substrates

1997-11-13

1999-10-12

Jones, Deborah

Stock material or miscellaneous articles

Composite

Of metal

B32B 1504

Patent

active

059652748

ABSTRACT:
An electronic circuit component having improved mechanical properties and thermal conductivity comprises NiAl and/or Ni.sub.3 Al, upon which an alumina layer is formed prior to applying the conductive elements. Additional layers of copper-aluminum alloy or copper further improve mechanical strength and thermal conductivity.

REFERENCES:
patent: 4500605 (1985-02-01), Fister et al.

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