Electronic circuitry

Details Electronic circuitry Electronic circuitry

1998-04-21

1999-12-28

Tolin, Gerald

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

16510433, 174 152, 361719, H05K 720

Patent

active

060089873

ABSTRACT:
An electronic circuit in which a heat pipe is mounted on a substrate for transporting heat from one region to another, the heat pipe also being secured to the substrate at a plurality of positions along the heat pipe for the purpose of increasing the stiffness of the substrate. The heat pipe may extend across a surface of the substrate or around an edge of the substrate. Heat conductive paths from the heat source may be provided by a ground plane within the substrate or a heat conductor may extend from the heat source to the heat pipe at a position spaced from the substrate.

REFERENCES:
patent: 3651865 (1972-03-01), Feldmanis
patent: 4366526 (1982-12-01), Lijoi
patent: 5343358 (1994-08-01), Hillbrink
patent: 5365749 (1994-11-01), Porter
patent: 5398748 (1995-03-01), Yamaji
patent: 5459639 (1995-10-01), Izumi
patent: 5513070 (1996-04-01), Xie
"Enclosure--Heat losses", Pioneer Electronic, 1 page, Japan 128584, Oct. 1979, Ploe.

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