Electronic circuit system unit with wiring substrate

Details Electronic circuit system unit with wiring substrate Electronic circuit system unit with wiring substrate

1992-11-24

1995-10-31

Mintel, William

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257723, 257724, H01L 2348, H01L 2944, H01L 2952, H01L 2960

Patent

active

054632498

ABSTRACT:
In an electronic circuit system unit having a semiconductor integrated circuit unit on a wafer scale, a semiconductor wafer (a semiconductor integrated circuit unit on a wafer scale) and a print wiring substrate are laid to overlap each other and semiconductor pellets are mounted on the print wiring substrate in the overlapping area of the print wiring substrate and the semiconductor wafer. In said electronic circuit system unit, an area being a part of the periphery of the semiconductor wafer is protruded from the periphery of the print wiring substrate being placed to overlap the semiconductor wafer, and the semiconductor wafer and the print wiring substrate are electrically connected to each other in an area being a part of the protruded part through wires.

REFERENCES:
patent: 4484215 (1984-11-01), Pappas
patent: 4675717 (1987-06-01), Herrero et al.
patent: 4755910 (1988-07-01), Val
patent: 4965653 (1990-10-01), Otsuka et al.
patent: 5027188 (1991-06-01), Owada et al.
patent: 5237204 (1993-08-01), Val
patent: 5239448 (1993-08-01), Perkins et al.

Affiliated with

Also associated with

Rating

Electronic circuit system unit with wiring substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electronic circuit system unit with wiring substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electronic circuit system unit with wiring substrate will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1774862