Electronic circuit substrates

Details Electronic circuit substrates Electronic circuit substrates

1988-08-02

1989-11-21

Kucia, R. R.

Electricity: conductors and insulators

Conduits, cables or conductors

Single duct conduits

428209, 4283155, 4283073, H05K 0103

Patent

active

048824550

ABSTRACT:
An electronic circuit substrate having excellent machinability and dimensional accuracy is disclosed, which comprises a porous ceramic sintered body having a three-dimensional network structure and contains permeable pores, and a resin filled into the permeable pores.

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Wu et al., Anodized Aluminum Substrate of Composite Type . . . , Conf. Proc. of 31st Electronic Components IEEE, May 1981, pp. 145 to 48 relied on Insulation/Circuits, Aug. 1970, p. 17, relied on copy in 174/68.5.
E. A. Corl, Hydrophonic Seal for Damaged PC Board Laminate, IBM Tech. Disc. Bull., vol. 23, #12, May 1981, p. 5479, relied on.
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