Electronic circuit substrate construction

Details Electronic circuit substrate construction Electronic circuit substrate construction

1987-11-27

1989-09-26

LaRoche, Eugene R.

Wave transmission lines and networks

Long lines

Strip type

174 685, 357 80, H01P 308, H05K 103

Patent

active

048703770

ABSTRACT:
A microwave substrate is formed by thermocompression bonding a metalization system layer to two substrates having corresponding properties. One of the properties in one material is significantly different in value than that property in the other material. The substrates are selected from polycrystalline and monocrystalline ceramic materials. The bonded slabs are sliced and ground planes attached to form finished composite substrates.

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Erwin F. Belohoubek, Adolph Presser & Harold S. Veloric, "Improved Circuit-Device Interface for Microwave Bipolar Power Transistors", IEEE Journal of Solid-State Circuits, vol. SC-11, No. 2, Apr. 1986, pp. 256-263.

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