Electronic circuit packages

Details Electronic circuit packages Electronic circuit packages

1978-12-21

1982-04-20

Husar, Francis S.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

29832, 294265, 174 16HS, 174 685, 357 69, 357 81, 525 1, 525 4, H05K 720, H05K 332, C08K 322

Patent

active

043262384

ABSTRACT:
An electronic circuit comprising a circuit substrate with electronic circuit elements bonded onto the circuit substrate with gaps between the circuit substrate and the respective electronic circuit elements has thermal conductive layers comprising an oxidatively curable resin filled into the gaps. The thermal conductive layers are produced by filling a varnish comprising an oxidatively curable resin into the gaps and exhibit excellent moist heat resistance and thermal conductive properties. The electronic circuit elements once mounted on the circuit substrate can easily be removed as required by releasing the bonding between the elements and the substrate.

REFERENCES:
patent: 3181229 (1965-05-01), Haberecht et al.
patent: 3390226 (1968-06-01), Beyerlein
patent: 3892708 (1975-07-01), Cronenberger et al.
patent: 3987002 (1976-10-01), Lakshmanan
patent: 4001655 (1977-01-01), Voyles et al.
patent: 4051454 (1977-09-01), Leiser et al.
patent: 4130707 (1978-12-01), Leiser et al.
patent: 4145317 (1979-03-01), Sado et al.
patent: 4163072 (1979-07-01), Soos
IBM Tech. Discl. Bull. vol. 7, No. 10, Mar. 1965, p. 860.
IBM Tech. Discl. Bull. vol. 17, No. 8, Jan. 1975, p. 2261.
IBM Tech. Discl. Bull. vol. 19, No. 7, Dec. 1976, p. 2638, by Crosby et al.
IBM Tech. Discl. Bull. vol. 14, No. 11, Apr. 1972, p. 3332, by W. E. Dunkel.

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