Electronic circuit package and method of brazing

Details Electronic circuit package and method of brazing Electronic circuit package and method of brazing

1974-12-26

1976-03-02

Clay, Darrell L.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

29626, 174 5061, 228122, 317101CM, 317101CP, H05K 500

Patent

active

039419169

ABSTRACT:
An electronic package assembly having a plurality of gold-plated lead pins solderably secured within a corresponding array of pre-metalized, cylindrical-shaped holes disposed in a ceramic substrate of the package. The interior surfaces defining the holes are pre-metalized with a layer of palladium-silver followed by a layer of gold. The pins are then brazed to the metalized hole interiors with a gold germanium filler metal which has been screen printed on the upper surface of the substrate in ring configurations outlining the pin receiving holes.

REFERENCES:
patent: 3136667 (1964-07-01), Knauf, Jr. et al.
patent: 3205298 (1965-09-01), Kalt
patent: 3312771 (1967-04-01), Hessinger et al.
patent: 3385618 (1968-05-01), Hargis
patent: 3404215 (1968-10-01), Burks et al.
patent: 3634600 (1972-01-01), Griffin et al.
patent: 3638304 (1972-02-01), Bleil
patent: 3862488 (1975-01-01), Pessell et al.

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