Electronic circuit package

Details Electronic circuit package Electronic circuit package

1998-09-29

2000-05-23

Cuchlinski, Jr., William A.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

257687, 257701, 257787, 439721, 439723, 439709, H01L 2328

Patent

active

060668040

ABSTRACT:
An electronic circuit package is provided in which a substrate accommodating chamber for accommodating a circuit substrate is formed in a case made of resin. The case has a plurality of terminals fixed thereto each having an internal connecting portion extending in parallel with the substrate. An electronic circuit on the circuit substrate is connected through a plurality of leads to the internal connecting portions. Substrate partitioning ribs for partitioning the internal connecting portions and the circuit substrate are integrally formed on the bottom surface of the substrate accommodating chamber. A terminal partitioning rib for partitioning adjacent internal connecting portions is also integrally formed on the bottom surface of the substrate accommodating chamber.

REFERENCES:
patent: 5233130 (1993-08-01), Nishino
patent: 5619012 (1997-04-01), Casali et al.

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