Electronic circuit modules cooling

Details Electronic circuit modules cooling Electronic circuit modules cooling

2007-05-03

2009-02-17

Thompson, Gregory D (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C165S080400, C361S689000, C361S707000, C361S708000

Reexamination Certificate

active

07492594

ABSTRACT:
A cooling structure for electrical circuit devices having a pair of cooling ducts, each having a coolant passageway therein, and an electrical circuit device housing formed by a pair of spaced apart heat transfer plates each joined to a housing side to provide a sealed housing space. An electrical circuit device is positioned in that sealed housing space and each of the pair of heat transfer plates is positioned adjacent to, and thermally coupled to, a corresponding one of the pair of cooling ducts. An electrically insulative heat transfer material is provided in the sealed housing space so as to be capable of being in contact with the electrical circuit device also therein.

REFERENCES:
patent: 3616533 (1971-11-01), Heap et al.
patent: 4203129 (1980-05-01), Oktay et al.
patent: 4268850 (1981-05-01), Lazarek et al.
patent: 4392153 (1983-07-01), Glascock et al.
patent: 5050037 (1991-09-01), Yamamoto et al.
patent: 5539617 (1996-07-01), Bochtler
patent: 5774334 (1998-06-01), Kawamura et al.
patent: 6084771 (2000-07-01), Ranchy et al.
patent: 6208511 (2001-03-01), Bortolini et al.
patent: 6992409 (2006-01-01), Torii et al.
patent: 7005734 (2006-02-01), Choi et al.
patent: 7019395 (2006-03-01), Hirano et al.
patent: 7057896 (2006-06-01), Matsuo et al.
patent: 7224493 (2007-05-01), Chelvayohan et al.
patent: 7248478 (2007-07-01), Inoue
patent: 7250674 (2007-07-01), Inoue
patent: 7252167 (2007-08-01), Nakamura et al.
patent: 2002/0124997 (2002-09-01), Blome
patent: 0239322 (1987-09-01), None
patent: 1748688 (2007-01-01), None
patent: 0079856 (2000-12-01), None

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