Electronic circuit module with power feed spring assembly

Details Electronic circuit module with power feed spring assembly Electronic circuit module with power feed spring assembly

1991-06-18

1992-10-27

Tolin, Gerald P.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

174 51, 361414, 439 92, H05K 720

Patent

active

051595303

ABSTRACT:
In an electronic circuit module, an array of male connectors (41, 46) are arranged on a ceramic substrate (40) to establish contact with external female connectors (20) and an array of LSI packages (5) is provided. Conductive layers (43) of power distribution pattern are embedded in the substrate and are coupled to the male connectors (41). Each LSI package includes a conductive housing (52), an LSI chip (50) secured thereto in a thermally conductive relationship and a base plate (51) which establishes source/ground current conduction paths between the chip and the housing and drain/source current conduction paths between the chip and appropriate layers of the ceramic substrate. An array of conductive springs (68) are supported by a lattice structure (60, 64) to establish a pressure contact with the housing of successive LSI packages to allow power currents to be supplied from an external source voltage terminal to all LSI packages. An array of cooling surfaces (73) are in thermal contact with the respective package housings through the apertures (62) of the lattice structure.

REFERENCES:
patent: 4652970 (1987-03-01), Watari
patent: 4711506 (1987-12-01), Tanaka
patent: 4744007 (1988-03-01), Watari
patent: 4771366 (1988-09-01), Blake
patent: 4860165 (1989-08-01), Cassinelli
patent: 4889959 (1989-12-01), Taylor
patent: 5061192 (1991-10-01), Chapin

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