Electronic circuit module and method for fabrication thereof

Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C361S772000

Reexamination Certificate

active

07320604

ABSTRACT:
Provided is an electronic circuit module using a board having no cavity and a method for efficiently fabricating it. Electronic components are mounted on the front face of a module board1, and an LSI chip5is die-bonded on the bottom face thereof in a bare-chip state with gold wires8. Around the LSI chip5, metal blocks9made of copper are mounted by soldering. The LSI chip5, the gold wires8, and the metal blocks9provided on the bottom face of the module board1are sealed with resin10with a motherboard-facing face9aof each metal block9and a face18thereof flush with the corresponding side face of the module board1exposed from the resin10. These exposed portions serve as electrode terminals when the module11is soldered to a motherboard. The module board1is obtained by cutting a sheet circuit board into individual unit module boards1.

REFERENCES:
patent: 4558397 (1985-12-01), Olsson
patent: 4814295 (1989-03-01), Mehta
patent: 5081520 (1992-01-01), Yoshii et al.
patent: 2003-60523 (2003-02-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Electronic circuit module and method for fabrication thereof does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electronic circuit module and method for fabrication thereof, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electronic circuit module and method for fabrication thereof will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2745069

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.