Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Reexamination Certificate
2008-01-22
2008-01-22
Nguyen, Khiem (Department: 2839)
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
C361S772000
Reexamination Certificate
active
07320604
ABSTRACT:
Provided is an electronic circuit module using a board having no cavity and a method for efficiently fabricating it. Electronic components are mounted on the front face of a module board1, and an LSI chip5is die-bonded on the bottom face thereof in a bare-chip state with gold wires8. Around the LSI chip5, metal blocks9made of copper are mounted by soldering. The LSI chip5, the gold wires8, and the metal blocks9provided on the bottom face of the module board1are sealed with resin10with a motherboard-facing face9aof each metal block9and a face18thereof flush with the corresponding side face of the module board1exposed from the resin10. These exposed portions serve as electrode terminals when the module11is soldered to a motherboard. The module board1is obtained by cutting a sheet circuit board into individual unit module boards1.
REFERENCES:
patent: 4558397 (1985-12-01), Olsson
patent: 4814295 (1989-03-01), Mehta
patent: 5081520 (1992-01-01), Yoshii et al.
patent: 2003-60523 (2003-02-01), None
Nguyen Khiem
Nixon & Vanderhye P.C.
Sharp Kabushiki Kaisha
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