Electronic circuit module

Electricity: electrical systems and devices – Safety and protection of systems and devices – With specific current responsive fault sensor

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Details

357 74, 357 82, 361382, 361385, 361389, 361398, 361412, 361413, H05K 114

Patent

active

047558660

ABSTRACT:
A high density of electronic chips 18 includes decals 26,40 which overlay a chip and an adjacent chip. Each decal includes conductor routing 64,67,69,80 to electrically connect the chip circuits. The decals may include capacitors 53,58,60 and terminating resistors 81. The chips are directly connected to the frame 112 or heat sink 116 which may be double sided.

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patent: 4652970 (1987-03-01), Watari et al.
patent: 4689103 (1987-08-01), Elarde
Thorpe et al., Multilayer Printed Circuit Board Connections, IBM. Tech. Disc. Bull., vol. #13, #10, May 1971, pp. 3708 & 3709.

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