Electronic circuit interconnection system

Details Electronic circuit interconnection system Electronic circuit interconnection system

1984-05-07

1985-10-08

Kucia, R. R.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

428620, H05K 103

Patent

active

045464065

ABSTRACT:
An electronic circuit interconnection system provides high density mounting of ceramic chip-carrier integrated circuit devices or other beam-lead, dual-in-line (DIP), tape-automated-bonded (TAB), flip-chip, or direct-mounted i.c. devices with wire-bonded interconnects or the like on an economical, dimensionally-stable, interconnection substrate which has high heat dissipating properties. The substrate has glass components which are fused onto etched metal patterns and which are proportioned relative to the metal patterns so that the heat-expansion properties of the substrate correspond to those of the i.c. devices to maintain bond integrity between the i.c. leads and circuit paths on the substrate and so that the substrate has sufficient heat-dissipating properties to permit the high density i.c. mounting. The substrates incorporate circuit paths, device mounting pads, edge terminals, pin mounting holes and other typical substrate features in the etched patterns in multimetal laminated metal plates of selected thickness which are coated on one or both sides with glass frit fused to the plates. Where substrates with more than one layer are desired, glass-coated plates are stacked with pin mounting holes and the like aligned and the glass coatings are fused together. Metal vias extend through the glass coatings where desired to interconnect metal layers of the substrate.

REFERENCES:
patent: 2753623 (1956-07-01), Boessenkool et al.
patent: 3351700 (1967-11-01), Savolainen et al.
patent: 3767370 (1971-11-01), Ornstein
patent: 3786172 (1974-01-01), Conley
patent: 3801388 (1974-04-01), Akiyama et al.
patent: 3812019 (1974-05-01), Needham et al.
patent: 3921285 (1975-11-01), Krall
patent: 3952231 (1976-04-01), Davidson et al.
patent: 4137628 (1979-02-01), Suzuki
patent: 4190474 (1980-02-01), Bordan et al.
patent: 4256796 (1981-03-01), Hang et al.
patent: 4301324 (1981-11-01), Kumar et al.
Liu, C. N., Matching the Thermal Coefficients of Expansion of Chips to Module Substrate, IBM Tech. Disc. Bull., vol. 19, #12, May 1977, pp. 4666 & 4667.
Gniewek et al., Titatnium Overlay of Metallurgy, IBM Tech. Disc. Bull., vol. 13, #5, Oct. 1970, pp. 1124 & 1125.
Sondej et al., Lamination of Metal Directly to Green Sheet Dielectric Material, IBM Tech. Dis. Bull., vol. 19, #2, Jul. 1976, pp. 431 & 432.
Kerjikian et al., Thermally Enhanced Multilayer Ceramic Substrate Structure, IBM Tech. Disc. Bull., vol. 18, #2, Jul. 1975, pp. 353 & 354.

Affiliated with

Also associated with

Rating

Electronic circuit interconnection system does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electronic circuit interconnection system, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electronic circuit interconnection system will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2223515