Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1998-10-06
2000-09-26
Bradley, Paula
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
439493, 439 74, 349150, H01R 1200
Patent
active
061235512
ABSTRACT:
An electronic circuit interconnection method and apparatus involves mating a first circuit substrate with a second circuit substrate such that a projection of a circuit component mounted on at least one of the first and second circuit substrates is received in an opening in the other. The opening has a shape complementary to the projection, to register the first and second circuit substrates in a fixed orientation relative to each other in which contacts on the first circuit substrate are aligned and adjacent corresponding contacts on the second circuit substrate. The first and second circuit substrates are then clamped together to press the contacts on each substrate toward each other to place and maintain them in contact with each other.
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Bradley Paula
Northern Telecom Limited
Ta Tho D.
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