Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2000-12-13
2003-04-29
Martin, David (Department: 2841)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S760000, C361S761000, C361S762000, C361S764000, C361S766000, C361S811000, C174S260000, C174S261000
Reexamination Certificate
active
06556453
ABSTRACT:
TECHNICAL FIELD OF THE INVENTION
The present invention relates generally to electronic circuit housings (e.g., packages, interposers, sockets, and printed circuit boards), and more particularly, to housings having embedded discrete devices, and methods of fabrication therefor.
BACKGROUND OF THE INVENTION
Electronic circuits, and particularly computer and instrumentation circuits, have in recent years become increasingly powerful and fast. As circuit frequencies continue to escalate, with their associated high frequency transients, noise in the power and ground lines increasingly becomes a problem. This noise can arise due to inductive and capacitive parasitics, for example, as is well known. To reduce such noise, capacitors known as decoupling capacitors are often used to provide a stable signal or stable supply of power to the circuitry.
Capacitors are further utilized to dampen voltage overshoot when an electronic device (e.g., a processor) is powered down, and to dampen voltage droop when the device powers up. For example, a processor that begins performing a calculation may rapidly need more current than can be supplied by the on-chip capacitance. In order to provide such current and to dampen the voltage droop associated with the increased load, off-chip capacitance should be available to respond to the current need within a sufficient amount of time. If insufficient current is available to the processor, or if the response time of the capacitance is too slow, the die voltage may collapse to a level that affects the processor's performance. The localized portions of a die that require large amounts of current in short periods of time are often referred to as die “hot spots.”
Decoupling capacitors and capacitors for dampening voltage overshoot or droop are generally placed as close as practical to a die load or hot spot in order to increase the capacitors' effectiveness. Often, the decoupling capacitors are surface mounted to the die side or land side of the package upon which the die is mounted.
FIG. 1
illustrates a cross-section of an integrated circuit package
102
having die side capacitors
106
and land side capacitors
108
in accordance with the prior art. Die side capacitors
106
, as their name implies, are mounted on the same side of the package as the integrated circuit die
104
. In contrast, land side capacitors
108
are mounted on the opposite side of the package
102
as the die
104
.
FIG. 2
illustrates an electrical circuit that simulates the electrical characteristics of the capacitors illustrated in FIG.
1
. The circuit shows a die load
202
, which may require capacitance or noise dampening in order to function properly. Some of the capacitance can be supplied by capacitance located on the die, as modeled by capacitor
204
. Other capacitance, however, must be provided off chip, as modeled by off-chip capacitor
206
. The off-chip capacitor
206
could be, for example, the die side capacitors
106
and/or land side capacitors
108
illustrated in FIG.
1
. The off-chip capacitor
206
may more accurately be modeled as a capacitor in series with some resistance and inductance. For ease of illustration, however, off-chip capacitor
206
is modeled as a simple capacitor.
Naturally, the off-chip capacitor
206
would be located some distance, however small, from the die load
202
, due to manufacturing constraints. Accordingly, some inductance, as modeled by inductor
208
, exists between the die load and the off-chip capacitor
206
. The value of inductor
208
is related to the “loop area,” which is the distance from die load
202
, through capacitor
206
, and back to die load
202
.
Because the inductor
208
tends to slow the response time of the off-chip capacitor
206
, it is desirable to minimize the loop area, thus reducing the value of inductor
208
. This can be achieved, in part, by placing the off-chip capacitor
206
as electrically close as possible to the die load.
Referring back to
FIG. 1
, die side capacitors
106
are mounted around the perimeter of the die
104
, and provide capacitance to various points on the die through traces, vias, and planes (not shown) in the package
102
. Because die side capacitors
106
are mounted around the perimeter of the die, the path length between a hot spot and a capacitor
106
may result in a relatively high inductance feature between the hot spot and the capacitor
106
.
In contrast, land side capacitors
108
can be mounted directly below die
104
, and thus directly below some die hot spots. Thus, in some cases, land side capacitors
108
can be placed electrically closer to the die hot spots than can die side capacitors
106
, resulting in a smaller loop area, and a lower inductance path to between the die hot spot and the capacitor
108
. However, the package also includes connectors (not shown), such as pins or lands, located on its land side. In some cases, placement of land side capacitors
108
on the package's land side would interfere with these connectors. Thus, the use of land side capacitors
108
is not always an acceptable solution to the inductance problem. In addition, in some cases, the thickness of the package could make the loop area unacceptably large.
Besides the inductance issues described above, additional issues are raised by the industry's trend to continuously reduce device sizes and packing densities. Because of this trend, the amount of package real estate available to surface-mounted capacitors is becoming smaller and smaller.
As electronic devices continue to advance, there is an increasing need for higher levels of capacitance at reduced inductance levels for decoupling, voltage dampening, and supplying charge. In addition, there is a need for capacitance solutions that do not interfere with package connectors, and which do not limit the industry to certain device sizes and packing densities. Accordingly, there is a need in the art for alternative capacitance solutions in the fabrication and operation of electronic devices and their packages.
REFERENCES:
patent: 5607883 (1997-03-01), Bhattacharyya et al.
patent: 6075285 (2000-06-01), Taylor et al.
Cotton, M., “Microfeatures & Embedded Coaxial Technology”,Electronic Circuits World Convention 8, 6 pgs., (Sep. 8, 1999).
Figueroa David G.
Watts Nicholas R.
LandOfFree
Electronic circuit housing with trench vias and method of... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Electronic circuit housing with trench vias and method of..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electronic circuit housing with trench vias and method of... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3067952