Electronic circuit encapsulation

Details Electronic circuit encapsulation Electronic circuit encapsulation

1980-10-02

1982-07-13

Lowe, James B.

Plastic and nonmetallic article shaping or treating: processes

Prestressing solid body and uniting in stressed condition

249 91, 249 95, 264261, 264263, 26427214, 26427215, 425111, 425117, 425123, B29C 602

Patent

active

043394078

ABSTRACT:
Encapsulation of electrical circuitry by high pressure injection molding of an insulative thermoplastic material about electrical components supported in a pre-formed carrier which is itself supported in an outer mold. The carrier has an internal configuration of lands and grooves which facilitates circuit insertion, the walls of which carrier are yieldable to flex inwardly to permit registration of the carrier walls with the outer mold and to securely hold the circuit during the injection process during which both the mold and the carrier are filled. The carrier is vented to insure complete encapsulation throughout the circuitry therein.

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