Electronic circuit device with reduced breaking and cracking

Details Electronic circuit device with reduced breaking and cracking Electronic circuit device with reduced breaking and cracking

2007-06-12

2007-06-12

Williams, Alexander Oscar (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

C257SE23036, C257SE23051, C257SE23066, C257SE25031, C257SE23023, C257SE23043, C257SE23052, C257S676000, C257S775000, C257S776000, C257S723000, C257S685000, C257S686000, C257S777000, C257S702000, C257S703000, C257S705000, C257S773000, C257S528000, C257S533000, C257S712000, C257S675000, C257S724000, C257S725000, C257S728000

Reexamination Certificate

active

10628443

ABSTRACT:
In an electronic circuit device including a substrate including a front surface on which an electronic circuit element is mounted and a reverse surface opposite to the front surface in a thickness direction of the substrate, an electrically conductive terminal member electrically connected to the electronic circuit element, a lead frame extending perpendicular to the thickness direction to face the reverse surface in the thickness direction, and a sealing resin covering at least partially the electronic circuit element, substrate and lead frame while at least a part of the electrically conductive terminal member is prevented from being covered by the sealing resin, the substrate extends to project outward from an end of the lead frame in a transverse direction perpendicular to the thickness direction while the end of the lead frame is covered by the sealing resin.

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