Electronic circuit device including metallic member having...

Details Electronic circuit device including metallic member having... Electronic circuit device including metallic member having...

2005-09-13

2005-09-13

Williams, Alexander Oscar (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257S713000, C257S712000, C257S710000, C257S778000, C257S737000, C257S738000, C257S685000, C257S723000, C257S777000, C257S686000, C257S784000, C257S668000, C257S675000

Reexamination Certificate

active

06943443

ABSTRACT:
Bumps are formed on electrodes of semiconductor elements, and moreover, the semiconductor elements with the bumps are electrically connected to metallic members having installation members, whereby wiring lines are eliminated. Stray inductance and conduction resistance resulting from wiring lines can be reduced. A conventional dented connector and a projecting connector are eliminated by connecting the installation members to a second circuit board, thereby enabling an electronic circuit device of a power control system to be made compact.

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