Electronic circuit device components having integral spacers pro

Stock material or miscellaneous articles – All metal or with adjacent metals – Having aperture or cut

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428603, 428615, 428929, 357 70, H01L 2348

Patent

active

046264787

ABSTRACT:
Spacing elements are integrally formed on the constituent surfaces of conductive interfaces of electronic circuit device components for providing uniform thickness solder or other bonding film between the surfaces. The interfaces may be electrically conductive interfaces such as those defined between leads and substrate contact pads as well as thermally conductive interfaces such as those defined between heat sinks and substrates. Any suitable spacers which maintain the constitutent surfaces a selected distance apart when the components are pressed together may be employed such as edge and corner flanges, convex dimples, annular protrusions, tangs, among others. A tool is disclosed for forming the annular protrusions that is advantageously employed with comparatively thick electronic circuit device components and with laminated electronic circuit device components having a comparatively hard layer.

REFERENCES:
patent: 1618611 (1927-02-01), Trout
patent: 3089062 (1963-05-01), Schulz
patent: 3805373 (1974-04-01), Sarolainen et al.
patent: 3947867 (1976-03-01), Duffek et al.
patent: 4147889 (1979-04-01), Andrews et al.
patent: 4346396 (1982-08-01), Carroll et al.
patent: 4396457 (1983-08-01), Bakermans
patent: 4402450 (1983-09-01), Abraham et al.
patent: 4438181 (1984-03-01), Schroeder
"Metallurgical Dictionary", Henderson et al, Reinhold Publishing Corp., NY, NY, 1953, p. 296, Solder.

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