Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Patent
1991-03-25
1994-01-04
Picard, Leo P.
Electricity: conductors and insulators
Conduits, cables or conductors
Preformed panel circuit arrangement
361783, H05K 100
Patent
active
052762890
ABSTRACT:
The present invention provides a multistep electronic circuit device comprising a plurality of parts and elements mechanically or electrically bonded in sequence to each other and to a substrate with a plurality of solders, which comprises as the parts and elements the substrate, input and output pins and LSI chips, and optionally packages and a cooler bonded through multistep bonding, the bondings of the parts and elements including at least one CCB bonding and at least one sealing, the solders each having a lower melting point than the heatproof temperature of the part or element to be bonded with the solder, and one of the solders having a melting point of at least 10.degree. C. lower than that of the other solder used at the bonding step immediately before. The solders used are selected from Au10-15wt%Ge alloy (melting point: 356.degree.-450.degree. C.), Pb1-5wt%Sn alloy (melting point: 314.degree.-325.degree. C.), Pb10-13wt%Sn alloy (melting point: 270.degree.-300.degree. C.), Au20wt%Sn alloy (melting point: 280.degree. C.), Sn3-6wt%Sb alloy (melting point: 232.degree.-243.degree. C.), Sn2-8wt%Ag alloy (melting point: 221.degree.-235.degree. C.), Sn35-55wt%Pb alloy (melting point: 183.degree. -200.degree. C.) and Sn45wt%Pb18wt%Bi (melting point: 135.degree.-160.degree. C.).
REFERENCES:
patent: 4561011 (1985-12-01), Kohara et al.
patent: 4673772 (1987-06-01), Satoh et al.
patent: 4970577 (1990-11-01), Ogihara et al.
patent: 5045922 (1991-09-01), Kodama et al.
Wassink, "Weichloten in der Elektronik", p. 133.
Beeferman, "Soldering Creams for Electronic Surface Mounted Devices", Welding Journal, pp. 37-40.
Harada Masahide
Kobayashi Fumiyuki
Matsui Kiyoshi
Netsu Tositada
Sasaki Hideaki
Figlin Cheryl R.
Hitachi , Ltd.
Picard Leo P.
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