Electronic circuit device and method of manufacturing the same

Details Electronic circuit device and method of manufacturing the same Electronic circuit device and method of manufacturing the same

2007-03-06

2007-03-06

Patel, Ishwar (I. B.) (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S259000, C257S737000

Reexamination Certificate

active

10798398

ABSTRACT:
An electronic component having connection terminals on one side thereof is bonded to a circuit board via an adhesive sheet having through-holes. The connection terminals on the electronic component are connected to electrode pads provided on the circuit board via a conductive adhesive in the through-holes. Thus, an electronic circuit device is formed. Using a polymeric resin film sheet for the circuit board and mounting an electronic component, e.g. an LSI, onto the circuit board can provide a small, light, thin, and inexpensive electronic circuit device.

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