Electronic circuit device and method of manufacturing same

Details Electronic circuit device and method of manufacturing same Electronic circuit device and method of manufacturing same

1988-04-14

1991-09-17

Prenty, Mark

357 75, 357 68, 357 71, H01L 3902, H01L 2316, H01L 2348

Patent

active

050499807

ABSTRACT:
Plural semiconductor elements are buried into an insulating substrate, and top surfaces of semiconductor elements and the substrate are in a same plane. A photosensitive dry film is covered on surfaces of the substrate and semiconductor elements. The photosensitive dry film has openings corresponding to electrodes of semiconductor elements, and conductors are filled in openings of the photosensitive dry film. The device has the multi-layer wiring construction without damaging to semiconductor elements arranged on the substrate.

REFERENCES:
patent: 4731645 (1988-03-01), Parmentier

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