Electronic circuit device and method of fabricating the same

Details Electronic circuit device and method of fabricating the same Electronic circuit device and method of fabricating the same

1999-05-28

2001-08-28

Thompson, Gregory (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C165S080300, C174S016300, C257S722000, C361S710000, C361S715000

Reexamination Certificate

active

06282092

ABSTRACT:

BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to an electronic circuit device for which a high heat radiating or dissipating ability is required and a method of fabricating such an electronic circuit device, and more particularly to the structure of a package of an electronic circuit device and a method for fabrication of the same.
2. Description of Related Art
Prior art will be described referring to
FIGS. 4 and 5
.
FIG. 4
shows the setting structure of a rectifier for vehicle disclosed by JP-Y-6-9577. A frame member
16
and a substrate
12
are fixed through screws
20
onto a surface of a pedestal or the like (not shown) on which the rectifier is to be installed. Thereby, a structure having an excellent productivity and a satisfactory heat dissipating efficiency is provided. In this structure, no radiating fin is used. There instead, heat dissipation is mainly made from a surface of the rectifier to be installed on the pedestal or the like (or a surface of the substrate
12
having no parts mounted thereon).
On the other hand, the conventional electronic circuit device using a radiating fin is shown in FIG.
5
. In the figure, reference numeral
21
denotes a metal substrate, numeral
22
denotes a case, numeral
23
denotes a mold resin, numeral
24
denotes a portion of the case
22
abutting against the substrate
21
, numeral
25
denotes a connector, numeral
27
denotes an installation surface of the electronic circuit device, numeral
28
denotes an end face of the case
22
, and numeral
29
denotes a radiating fin. In such conventional electronic circuit device with radiating fin, a surface of the metal substrate having no parts mounted thereon is brought into contact with the bottom of the case, thereby improving the heat dissipation from the radiating fin.
However, in the setting structure of the rectifier for this vehicle shown in
FIG. 4
, heat dissipation is mainly made from the surface of the substrate
12
having no parts mounted thereon, that is, the heat dissipation from a surface of the substrate having parts mounted thereon is not taken into consideration.
In the electronic circuit device shown in
FIG. 5
, the dissipation of heat thermally conducted from the surface of the metal substrate
21
having no parts mounted thereon and radiated from the radiating fin
29
is satisfactory but the heat dissipation from the installation surface of the electronic circuit device (or a surface of the metal substrate
21
having parts mounted thereon) is not particularly taken into consideration.
SUMMARY OF THE INVENTION
An object of the present invention made in light of the above-mentioned problems is to provide an electronic circuit device which has a heat dissipating ability superior to that of the conventional device.
To attain the above object, an electronic circuit device according to the present invention comprises a metal substrate having a first surface and a second surface, electronic parts mounted on only the first surface of the metal substrate, a case, united with a radiating fin in one body, for housing the metal substrate therein such that the metal substrate serves as a cap of the case and the first surface of the metal substrate faces to the case, and a resin disposed in a space between the metal substrate and the case, whereby heat generated from the electronic parts is dissipated to the exterior from both the radiating fin and the second surface of the metal substrate.
A method of fabricating an electronic circuit device according to the present invention comprises the step of mounting electronic parts on a metal substrate having a first surface and a second surface, the electronic parts being mounted on only the first surface of the metal substrate, the electronic parts including a plurality of electrodes for connecting the electronic circuit device to an external circuit, the step of installing the metal substrate in a case united with a radiating fin in one body such that the metal substrate serves as a cap of the case and the first surface of the metal substrate faces to the case, the case being provided with an opening for drawing out the plurality of electrodes to the exterior, the step of injecting a resin into a space between the metal substrate and the case from the opening of the case, and the step of inserting a member into the opening of the case which protects the plurality of electrodes.
With the construction of the present invention in which the metal substrate is installed in the case such that the metal substrate serves as a cap of the case and the surface of the metal substrate having the parts mounted thereon faces to the case or a surface of the metal substrate having no parts is directed outwards and the space between the metal substrate and the case is filled with the resin, a large amount of heat can be dissipated from both the radiating fin of the case and a surface of the electronic circuit device to be installed on a pedestal or the like, that is, a surface of the metal substrate having no parts, thereby improving the heat dissipation of the metal substrate.


REFERENCES:
patent: 4763225 (1988-08-01), Frenkel et al.
patent: 4899256 (1990-02-01), Sway-Tin
patent: 5155660 (1992-10-01), Yamada et al.
patent: 2281797 (1990-11-01), None
patent: 69577 (1994-03-01), None

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