Electronic circuit device and method for manufacturing same

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C174S255000, C174S259000, C174S261000, C361S760000, C361S783000, C257S725000, C257S734000, C257S737000, C257S738000, C428S143000, C428S220000, C428S327000, C438S119000, C438S125000, C438S151000, C438S162000, C438S486000, C438S612000, C439S091000

Reexamination Certificate

active

07935892

ABSTRACT:
Circuit board having conductor wiring and connection terminal; anisotropic conductive resin layer provided on one surface of circuit board; and plurality of electronic components respectively provided with electrode terminals in positions facing the connection terminal are included. The anisotropic conductive resin layer includes at least one kind of conductive particles selected from coiled conductive particles, fiber fluff conductive particles and conductive particles provided with a plurality of conductive protrusions, and resin binder; electrically couples electrode terminals of plurality of electronic components to connection terminals to each other with conductive particles; mechanically fixes electronic components and circuit board to each other; and protects conductor wiring.

REFERENCES:
patent: 617287 (1899-03-01), Garlock
patent: 5019944 (1991-05-01), Ishii et al.
patent: 5122430 (1992-06-01), Nishitsuji et al.
patent: 5374467 (1994-12-01), Sato
patent: 5989405 (1999-11-01), Murata et al.
patent: 5994165 (1999-11-01), Yoshino et al.
patent: 6356333 (2002-03-01), Uchiyama
patent: 6506980 (2003-01-01), Hashimoto
patent: 6542374 (2003-04-01), Muramatsu et al.
patent: 6603107 (2003-08-01), Miyake
patent: 6803296 (2004-10-01), Miyairi
patent: 6831717 (2004-12-01), Hanakawa et al.
patent: 6909178 (2005-06-01), Sakamoto et al.
patent: 6916433 (2005-07-01), Mitani et al.
patent: 6927818 (2005-08-01), Hinata et al.
patent: 6955948 (2005-10-01), Asahi et al.
patent: 7004376 (2006-02-01), Ashida
patent: 7060602 (2006-06-01), Saito
patent: 7109074 (2006-09-01), Ichijo et al.
patent: 7161371 (2007-01-01), Higashitani et al.
patent: 7166920 (2007-01-01), Saito et al.
patent: 7341642 (2008-03-01), Kumakura
patent: 7384828 (2008-06-01), Asami et al.
patent: 2003/0029559 (2003-02-01), Yamada et al.
patent: 2004/0130024 (2004-07-01), Tsukahara et al.
patent: 2005/0127504 (2005-06-01), Imai
patent: 11-195860 (1999-07-01), None
patent: 11-306861 (1999-11-01), None
patent: 2000-133330 (2000-05-01), None
patent: 2000-195339 (2000-07-01), None
patent: 2001-102410 (2001-04-01), None
patent: 2002/0014615 (2002-02-01), None
patent: 6344156 (2002-02-01), None
patent: 2003-204135 (2003-07-01), None
patent: 2004-238443 (2004-08-01), None
Partial English Translation of JP 2000-133330A (May 2000), which was cited in Information Disclosure Statement filed Sep. 27, 2007.
Partial English Translaion of JP 2003-204135A (Jul. 2003), which was cited in Information Disclosure Statement filed Sep. 27, 2007.
International Search Report issued May 16, 2006 in the International (PCT) Application of which the present application is the U.S. National Stage.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Electronic circuit device and method for manufacturing same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electronic circuit device and method for manufacturing same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electronic circuit device and method for manufacturing same will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2682379

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.