Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Housing or package filled with solid or liquid electrically...
Patent
1999-01-20
2000-11-28
Ngo, Ngan V.
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Housing or package filled with solid or liquid electrically...
257698, 257730, 257774, 257788, H01L 2324, H01L 2304, H01L 2940, H01L 2329
Patent
active
061539309
ABSTRACT:
An electronic circuit device is provided which can avoid unnecessary spreading of a sealing resin and on which components can be mounted at a high mounting density. An enclosure for preventing the resin from flowing outside its intended boundaries and having a larger size than a chip in a chip mounting area of a circuit board is formed. The chip is mounted in a face-down orientation in the chip mounting area enclosed by the enclosure. A sealing resin is cast through a gate for casting a resin and introduced into the gap between the chip and the circuit board. It can be judged whether the charging of the resin has been completed or not, by checking the flowing of the resin into the groove.
REFERENCES:
patent: 5641996 (1997-06-01), Omoya et al.
patent: 5737191 (1998-04-01), Horinchi et al.
Murata Manufacturing Co. Ltd.
Ngo Ngan V.
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