Electronic circuit device and manufacturing method thereof

Details Electronic circuit device and manufacturing method thereof Electronic circuit device and manufacturing method thereof

1993-02-19

1994-09-13

Abrams, Neil

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

With provision to conduct electricity from panel circuit to...

29883, 361735, 439 69, 439331, 439487, H01R 2372

Patent

active

053464028

ABSTRACT:
It is an object of the invention to provide an electronic circuit device in which semiconductor elements, resistors, capacitors and the like are packaged onto an insulating substrate such as a ceramic substrate or the like, wherein high-density packaging is realized. A circuit module comprises a terminal section having an annular insulating frame body and a plurality of terminals provided on respective portions of the frame body to extend outwardly therefrom, and a circuit substrate having wiring patterns each adapted for connection with the respective terminals of the terminal section and packaging to one surface of the circuit substrate surface packaging parts, the circuit substrate being connected to the terminals with the surface packaging parts directed toward the inside of the terminal section. One circuit module is stacked on the other circuit module to be connected to the latter by the terminals. Thus high-density packaging can be readily realized.

REFERENCES:
patent: 3771109 (1973-11-01), Bruckner et al.
patent: 4433886 (1984-02-01), Cassarly et al.
patent: 4648666 (1987-03-01), Lovell
patent: 4872843 (1989-10-01), Anstey
patent: 4890199 (1989-12-01), Beutler

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