Electronic circuit device and manufacturing method of the same

Details Electronic circuit device and manufacturing method of the same Electronic circuit device and manufacturing method of the same

2007-03-08

2009-10-20

Lee, Edmund H. (Department: 1791)

Plastic and nonmetallic article shaping or treating: processes

Mechanical shaping or molding to form or reform shaped article

To produce composite, plural part or multilayered article

C264S511000, C264S263000, C264S272150, C264S334000

Reexamination Certificate

active

07604765

ABSTRACT:
A casing of an electronic key transmitting and receiving apparatus is formed to seal entire bodies of circuit parts, a mounting face of a printed board, on which the circuit parts are mounted, and parts of terminals while the other parts of the terminals are exposed. A rear face of the printed board opposite from the mounting face provides a part of an outer surface of the casing. When the printed board is provided in the casing through an insert molding process, the printed board is held in a cavity of a molding die such that the rear face of the printed board closely contacts an inner face of the cavity. Accordingly, deformation of the printed board due to pressure caused when the resin is poured or when the resin hardens is inhibited.

REFERENCES:
patent: 4775333 (1988-10-01), Grider et al.
patent: 5120231 (1992-06-01), Masumoto
patent: 5264656 (1993-11-01), Itakura et al.
patent: 5447888 (1995-09-01), Takashima et al.
patent: 5478517 (1995-12-01), Erdos
patent: 5677568 (1997-10-01), Ochi et al.
patent: 5774342 (1998-06-01), Brandenburg et al.
patent: 6787093 (2004-09-01), Kiritani
patent: 7118646 (2006-10-01), Hunkeler
patent: 7144258 (2006-12-01), Ariga et al.
patent: 2005/0136852 (2005-06-01), Nakagawa et al.
patent: 2006/0077643 (2006-04-01), Mayuzumi et al.
patent: 2006/0272150 (2006-12-01), Eguchi et al.
patent: 10 2004 026870 (2004-12-01), None
patent: 61-222715 (1986-10-01), None
patent: 61-268416 (1986-11-01), None
patent: 05-59807 (1993-03-01), None
patent: 6-224241 (1994-08-01), None
patent: 8-63567 (1996-03-01), None
patent: 9-120852 (1997-05-01), None
patent: 9-234984 (1997-09-01), None
patent: 10-79453 (1998-03-01), None
patent: 2001-237022 (2001-08-01), None
patent: 2004-52471 (2004-02-01), None
patent: 2004-111435 (2004-04-01), None
patent: A-2004-134198 (2004-04-01), None
Office Action dated Jan. 15, 2008 issued in U.S. Appl. No. 11/408,076.
Office Action dated Apr. 3, 2008 in U.S. Appl. No. 11/408,076.
Chinese Official Action dated Aug. 1, 2008, issued in counterpart Chinese Application No. 200610077782.4 with English translation.
Office Action dated Jul. 12, 2007, issued in U.S. Appl. No. 11/408,076.
German Office Action dated Oct. 23, 2007 issued in corresponding German Application No. 10 2006 018 364.9-55 with English translation.
Information Offer Form dated Sep. 24, 2008, submitted in counterpart Japanese Application No. 2005-125573, with translation.
Information Offer Form submitted in corresponding Japanese Application No. 2005-125573 dated Oct. 22, 2007 with English translation.
Chinese Office Action dated Jun. 5, 2009, issued in counterpart Chinese Application No. 2006100777824, with English translation.

Affiliated with

Also associated with

Rating

Electronic circuit device and manufacturing method of the same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electronic circuit device and manufacturing method of the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electronic circuit device and manufacturing method of the same will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4119393