Electronic circuit device and its manufacturing method

Details Electronic circuit device and its manufacturing method Electronic circuit device and its manufacturing method

2007-02-20

2007-02-20

Reichard, Dean (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

Reexamination Certificate

active

10860653

ABSTRACT:
It comprises circuit board10with circuit pattern2formed by conductive resin paste on resin substrate1, surface-mounted type electronic components30, 40arranged with electrode terminals with respect to the connecting region of circuit pattern2, connecting member3formed from conductive resin paste for connecting the connecting region to the electrode terminal, and insulating adhesive6for bonding the electronic components30, 40and circuit board10, which is lower in curing temperature than conductive resin paste and disposed in a space between circuit board10and electronic components30, 40between connecting regions.

REFERENCES:
patent: 5972735 (1999-10-01), Dominic
patent: 6663946 (2003-12-01), Seri et al.
patent: 2002/0134584 (2002-09-01), Higuchi et al.
patent: 2002/0166685 (2002-11-01), Miyamura et al.
patent: 62-2593 (1987-01-01), None
patent: 3-136290 (1991-06-01), None
patent: 07-030236 (1995-01-01), None
patent: 09-017601 (1997-01-01), None
patent: 2000-204263 (2000-07-01), None

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