Electronic circuit device

Details Electronic circuit device Electronic circuit device

1995-10-23

1998-03-24

Ryan, Patrick

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

428432, 428433, 22818021, 174263, B32B 300, B32B 1500, B23K 3102, H01R 909

Patent

active

057310661

ABSTRACT:
In an electronic circuit device having an input/output pin junction electrode, in order to remarkably improve the junction characteristics such as wettability and junction strength and to drastically simplify the production process, in forming an electronic circuit board in which glass ceramics is used for board material and a wiring conductor and junction electrode wherein the Cu is sized to extend beyond the pin hole so that solder only contacts it and not the ceramic circuit board. The wiring and junction electrode is formed in a same process while forming a cover coat on the electrode using board material, and Au or Au--Ni laminated film is formed on this electrode as occasion demands, and then an electronic component is connected thereto using a solder such a Au--Sn or Au--Ge.

REFERENCES:
patent: 4743489 (1988-05-01), Hasegawa
patent: 4761325 (1988-08-01), Kurihara et al.
patent: 4861646 (1989-08-01), Barringer et al.
patent: 4879156 (1989-11-01), Herron et al.
patent: 5004640 (1991-04-01), Nakatani et al.
patent: 5429100 (1995-07-01), Satoh et al.
IEEE Transactions on Components, Hybrids, and Manufacturing Technology, vol. 15, No. 2, May 1992 (English document).

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