Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Housing or package filled with solid or liquid electrically...
Reexamination Certificate
2007-11-20
2007-11-20
Quach, T. N. (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Housing or package filled with solid or liquid electrically...
C257S724000, C257S729000, C257SE23026
Reexamination Certificate
active
10910903
ABSTRACT:
In order to provide a low-cost and high heat-radiating electronic circuit device featuring high compactness, little warpage, high air tightness, high moldability, high mass productivity, high reliability against thermal shocks, and high oil-proof reliability, a module structure made by packing a whole multi-layer circuit board which connects a semiconductor operating element, semiconductor memory elements, and passive elements thereon and part of a supporting material on which said multi-layer circuit board is placed into a single package by transfer-molding; wherein said multi-layer circuit board and said supporting material are bonded together with a compound metallic material made up from copper oxide and at least one metal selected from a set of gold, silver, and copper.
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Ishii Toshiaki
Masuda Mitsuhiro
Satoh Toshiya
Tsuyuno Nobutake
Crowell & Moring LLP
Hitachi , Ltd.
Quach T. N.
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