Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate
2007-11-20
2007-11-20
Baumeister, B. William (Department: 2891)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Of specified material other than unalloyed aluminum
C257S700000, C257SE23023
Reexamination Certificate
active
11195818
ABSTRACT:
An electronic circuit device includes at least a first substrate and a second substrate, a spacer substrate interposed between the first substrate and the second substrate, an electronic component interposed between the first substrate and the second substrate, and at least one through-hole formed on the second circuit substrate opposing the first circuit substrate. The spacer substrate mutually connects the first substrate and the second substrate. The electronic component is connected to the first circuit substrate with the active surface of the electronic component. The through-hole penetrates from a first surface of the second circuit substrate opposing the first substrate to a second surface of the second circuit substrate. The first circuit substrate is connected to the electronic component.
REFERENCES:
patent: 5081563 (1992-01-01), Feng et al.
patent: 5306670 (1994-04-01), Mowatt et al.
patent: 5497033 (1996-03-01), Fillion et al.
patent: 5590461 (1997-01-01), Ishida
patent: 5597643 (1997-01-01), Weber
patent: 6023413 (2000-02-01), Umezawa
patent: 6377461 (2002-04-01), Ozmat et al.
patent: 6855892 (2005-02-01), Komatsu et al.
patent: 6991966 (2006-01-01), Tuominen
patent: 7179742 (2007-02-01), Nuytkens et al.
patent: 2001/0010569 (2001-08-01), Jin et al.
patent: 2001/0027605 (2001-10-01), Nabemoto et al.
patent: 2004/0227227 (2004-11-01), Imanaka et al.
U.S. Appl. No. 11/195,818, filed Aug. 3, 2005, Kawakami et al.
U.S. Appl. No. 11/195,719, filed Aug. 3, 2005, Kawakami et al.
Kawakami Yoshiteru
Nakamura Yasuharu
Anya Igwe U.
Baumeister B. William
Oblon & Spivak, McClelland, Maier & Neustadt P.C.
Sony Corporation
LandOfFree
Electronic circuit device does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Electronic circuit device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electronic circuit device will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3809458