Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
Reexamination Certificate
2008-05-13
2008-05-13
Everhart, Caridad M. (Department: 2891)
Semiconductor device manufacturing: process
Chemical etching
Combined with the removal of material by nonchemical means
C257S693000, C257S697000, C257SE23070, C257SE23020
Reexamination Certificate
active
07371687
ABSTRACT:
An electronic circuit device has a high-density mount board (2), on which are disposed a microcomputer (3) and random access memory (7) which are connected to each other through an exclusive memory bus (12) for high-speed data transfer, a programmable device (8) which is a variable logic circuit represented by FPGA, and an electrically-rewritable nonvolatile memory (16) which can store the operation program of the microcomputer. The high-density mount board has external mounting pins on the bottom surface so that it can be mounted on a mother board in the same manner as a system on-chip multi-chip module. With an intended logic function being set on the programmable device, a hardware-based function to be realized by the electronic circuit device can be simulated. With an operation program being written to the nonvolatile memory, a software-based function to be realized can be simulated. Consequently, the device facilitates the debugging at early stages of system development, configures a prototype system, and contributes to the time reduction throughout the system development, prototype fabrication and large-scale production.
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International Search Report from the Japanese Patent Office, dated Apr. 3, 2001.
Fujita Ryo
Kubo Masaharu
Kubo Osamu
Mishima Michihiro
Noguchi Kouki
A. Marquez, Esq. Juan Carlos
Everhart Caridad M.
Fisher Esq. Stanley P.
Reed Smith LLP
Renesas Technology Corporation
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