Electronic circuit component

Details Electronic circuit component Electronic circuit component

1998-06-26

2000-05-09

Jones, Deborah

Electricity: conductors and insulators

Conduits, cables or conductors

Superconductors

365162, 365160, 428457, 428334, B32B 1508, B32B 1520, H01B 1206

Patent

active

060606649

ABSTRACT:
A prior-art electronic circuit component comprising an insulating film and a circuit conductive layer made of a superconducting metal suffers low reliability resulting from insufficient adhesion between these layers. An electronic circuit component of the invention comprises an insulating film made of a high polymer material having a dielectric constant of 2.5 or less, a base metal layer formed of copper on the insulating film, having a thickness of 0.01 to 0.3 .mu.m, and a circuit conductive layer formed of at least one of niobium and niobium nitride on the base metal layer. The electronic circuit component of the invention can accomplish an increased adhesion between the insulating film and the circuit conductive layer. Furthermore, by sequentially forming, on the circuit conductive layer, a conductive-layer coating metal layer made of at least one of aluminum and copper, the insulating film, the base metal layer and the circuit conductive layer, there can be obtained a multi-layered circuit substrate with a superconducting circuit of high density and high-level function.

REFERENCES:
patent: 4075756 (1978-02-01), Kircher et al.
patent: 4997719 (1991-03-01), Ohshima et al.
patent: 5476719 (1995-12-01), Sandell et al.
patent: 5774336 (1998-06-01), Larson

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